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2.5Gbps 1310nm DFB Laser Chip
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LV02-DC31-I01 工作溫度 -40-85℃
Chip configuration: Chip Length: 250 (±25) um Chip Width: 220 (±25) um Thickness: 110 (±20) um?
LV02-DC31-C02 工作溫度 0-70℃? SMSR>35dB
Chip configuration: Chip Size: 200*200 (±20) um Thickness: 110 (±10) um Bonding Pad ?70um??
滿足不同客戶需求