Ti900 導熱復合材料
●高電氣絕緣●低熱阻●容易施工
以聚醯亞胺為基材,常用于需要高電器絕緣之電子產品。
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED back light, Mother Board, Power Supply,Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, NIC, screens, etc.
物性表
物性 | Ti900 | 單位 | 公差 | 測試方法 |
Thermal Conductivity 導熱系數 | 1.9 | W / mK | ±10% | ASTM D5470 |
Thickness 厚度 | 0.12 | mm | – | ASTM D374 |
Color 顏色 | Gray灰 | – | – | Visual目視 |
base 基材 | Polyimide | – | – | – |
Insulation Strength Vac 耐電壓 | 6.1 | KV / mm | – | ASTM D149 |
Volume resistance 體積阻抗 | >1012 | Ohm-m | – | ASTM D257 |
Working temperature 工作溫度 | -50~+180 | °C | – | – |
Tensile Strength 抗拉強度 | 5000 | psi | – | ASTM D412 |
Elongation 延展率 | 40 | % | – | ASTM D412 |
Flame rating 耐燃等級 | V-0 | – | – | UL 94 |
Standard Shape標準形狀 | Sheet ones單片狀 | – | – | – |
●符合REACH規(guī)范 ●符合RoHS規(guī)范 ●符合UL規(guī)范 | ||||
●Need samples?樣品需求? ●Pre-cut for different shapes可依需求沖型裁切 |